TS4231 Optical Receiver ICThe TS4231 coupled with an external photodiode is a complete optical receiver for modulated infrared light. This is the type of receiver used in Valve Corporation's SteamVR(tm) Tracking.
The TS4231 replaces some 100 components with a single tiny IC. The TS4231 uses Wafer Level Chip Scale Packaging (WLCSP) to achieve small size and low cost. 1.6mm x 1.6mm WLCSP 9-bumps, 0.5mm bump-to-bump spacing Note: the TS4231 IC is implemented on Triad's Fast Analog* technology. We can customize the TS4231 circuit to your requirements quickly and cost effectively (learn more). |
TS4231 Optical Receiver ICThe TS4231 coupled with an external photodiode is a complete optical receiver for modulated infrared light. This is the type of receiver used in Valve Corporation's SteamVR(tm) Tracking.
The TS4231 replaces some 100 components with a single tiny IC. The TS4231 uses Wafer Level Chip Scale Packaging (WLCSP) to achieve small size and low cost. 1.6mm x 1.6mm WLCSP 9-bumps, 0.5mm bump-to-bump spacing Note: the TS4231 IC is implemented on Triad's Fast Analog* technology. We can customize the TS4231 circuit to your requirements quickly and cost effectively (learn more). |
TS8000 Ultrasonic Receiver ICThe TS8000 is a complete 40kHz ultrasonic receiver on a chip. The TS8000 was implemented on the same Fast Analog* platform as the TS4231 by changing a single via mask layer (Triad fast analog* magic).
The TS8000 development was completed in 120 days from project kick-off to working silicon and released to production 30 days later. The TS8000 replaces multiple op-amp stages, comparators, and discrete resistors and capacitors. Additionally, the TS8000 contains digitally programmable gain settings, bandpass filter control and slicing level threshold control. 1.6mm x 1.6mm WLCSP, 16-bump, 0.4mm bump-to-bump spacing The TS8000 is implemented on Triad's Fast Analog* technology and can be customized to your requirements for less time and cost than you might expect (learn more). |
Analog* SoC - Hundreds of ConvertersThis analog* System-on-Chip combines a large number of data converters and other analog functions into a tiny space:
??mm x ??mm WLCSP package ??? Copper Pillar Bumps 0.2mm bump-to-bump spacing |