Industrial ASIC Applications
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Triad Semiconductor designs and manufactures custom integrated circuits for industrial applications.
Our Industrial ASIC customers count on Triad to:
Industrial ASIC applications often require high-performance semiconductor process capabilities including:
Our Industrial ASIC customers count on Triad to:
- Design high-performance mixed-signal ASICs for critical products
- Deliver IP, design know-how, and IC architecture expertise to accelerate development
- Satisfy demanding industrial reliability, quality and certification requirements
- Provide high-quality ASIC production with a commitment to long-term supply
Industrial ASIC applications often require high-performance semiconductor process capabilities including:
- Precision, low-noise analog signal processing
- High-voltage operation (up to 120V)
- High-temperature operation (> 150°C)
- High-resolution data converters (16 to 24 bit)
- Embedded microcontrollers and non-volatile memory (8051, ARM Cortex M0/M3/M4, Flash)
Functional Safety and Intrinsic Safety Requirements
Coupled with demanding performance requirements, industrial custom IC solutions are often used in mission-critical applications such as mines, chemical refineries, factories, reactors, and safety equipment for hazmat workers. Triad works with our customers to deliver ASIC solutions that are certified for:
We help you achieve Intrinsic and Functional Safety certifications by providing you with the know-how and experience to translate your system-level requirements into the appropriate Functional/Intrinsic Safety ASIC requirements. We will explore and provide consultation in areas such as:
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Mixed Signal IP for Industrial ASIC Applications
Triad's semiconductor processes are optimized for combining precision analog, high-voltage analog, data converters, embedded microcontrollers and custom digital circuits.
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Triad Semiconductor - Industrial ASIC Application Examples
Noxious Gas Sensor ASIC
Mixed-Signal custom IC with precision analog front-end (AFE), 16-bit ADC, embedded micro, non-volatile memory, low-power operation... > Read More |
Functional Safety I/O ASIC
Triple Mode Redundant (TMR) mixed-signal ASIC with data acquisition and actuation control. The IC contained three physically isolated blocks... > Read More |
Hi-Resolution ADC + HART Modem
Precision analog front-end, 24-bit ADC, multiple voltage domains, HART Modem,... > Read More |
Foundry Process Selection
Triad utilizes established, industry recognized, global, and stable foundry partners with an industrial emphasis
We utilize proven industry standard processes with proven manufacturability, design rules, design kits and industrial application support.
Our foundry selection process requires our foundry partners to satisfy the following requirements:
Our foundry selection process requires our foundry partners to satisfy the following requirements:
- Commitment to Long-Term Supply
- Foundry Process Reliability
- Demonstrated Product Performance
- Wafer Level Process Reliability
Commitment to Long-Term Supply
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Triad has made a strategic decision to utilize industry standard semiconductor process flows, materials and controls. By utilizing economical, popular, and “centrist” processes with standard options we work with the foundry to ensure that your design is implemented on a flow that will be supported for 10 to 15-plus years.
Your design will be implemented on semiconductor processes that are already supporting a large number of industrial, medical, defense and automotive customers.
Your design will be implemented on semiconductor processes that are already supporting a large number of industrial, medical, defense and automotive customers.
Foundry Process Reliability
Triad uses proven, qualified semiconductor process geometries from 0.35µm to 55nm.
- Process qualifications are conducted per industry standard test methods and per acceptance criteria specified in JEDEC JEP001.
- We adhere to foundry design rules, design kits and recommended foundry best practices to ensure expected life in final products.
- Device testing represents 10+ year life (@ 125C)
Demonstrated Product Performance
- FIT < 100
- MTBF > 10,000,000 hours
Wafer Level Process Reliability
Wafer level reliability reports per JEDEC JEP001 include:
- FEOL (Front End of Line)
- Gate Oxide Integrity (GOI)
- Hot Carrier Injection (HCI)
- Bias Temperature Instability Stress (NBTI/PBTI)
- BEOL (Back End of Line)
- Electro-migration (EM)
- Time dependent dielectric breakdown (TDDB)
Reliability Testing Laboratories
Triad partners with established, well recognized global leaders in semiconductor test.
Together with our semiconductor, packaging and final assembly test partners,
we have extensive experience exceeding industry standards for testing methods.
- SE Labs
- Integra Technologies
Together with our semiconductor, packaging and final assembly test partners,
we have extensive experience exceeding industry standards for testing methods.
- ISO 9001:2008 Quality Management System
- ISO17205 Testing and Calibration Laboratory Sandard